Lead length before bend: Preferred - Component lead should be straight from component end seal for a distance greater than 1 lead diameter, but not less than 0.031" (0.8 mm).
Acceptable - Minimum distance I lead diameter or 0.031".
Note: Measurement shall be made from the end of the part. (The end of the part is defined to include any coating meniscus, solder seal, solder or weld bead, or any other extension.
|A. Standard Bend||B. Welded Bend|
|Lead Diameter||Minimum Bend Radius ®|
|Less than to 0.8 mm|
|1 diameter / thickness|
|From 0.8 to 1.2 mm|
(0.031 to 0.047 in)
|1.5 diameters / thickness|
|Greater than 1.2 mm|
|2 diameters / thickness|
Axial Components Mounting Height:
Off the board mount:
|FULL CLINCH||PARTIAL CLINCH||STRAIGHT THROUGH|
Minimum Lead Length for Partial Clinch and Straight Through terminations - lead must be discernible in soldered connection.
Maximum Lead Length - 1.5 mm (0.0591 in)
Acceptable - Lead Outline must be discernible in the soldered connection.
Preferred - Lead clinched a minimum of one-half (1/2) the land dimension (Diameter when land is round).
Maximum Acceptable - Lead end should not extend beyond the edge of the land, however, if overhang does occur, the lead must not violate minimum electrical spacing requirements, and must not exceed 2.5 mm (.0984 in) in total lead length measured from the center of the platted through hole.
Preferred - Solder forms a complete fillet around lead. Solder is smooth, bright, and feathers out to thin edge. Contour of lead is clearly discernible in the solder.
Acceptable - Solder may be in bend area not contacting component body.
Minimum Acceptable - Solder is recessed a maximum of 25% of the board's thickness. Solder coverage a minimum of 270 degrees around lead.
Rejectable - Solder in bend area contacting component body.
For more information on soldering and soldering techniques, visit the NASA Technical Standards Website.